Skill and technical groups create new values.

Supporting the fast-paced progress of semi-conductor packages and demands for even lighter, smaller and highly advanced electronic equipment is our company's package substrates. Wealth for the inquisitive minds, and the professional technical and skill groups lead to new values.

Providing a sophisticated substrate for semi-conductor packages that includes BGA, CSP, which make use of each type of surface preparation techniques together with ultra thin substrate processing techniques and ultra fine wiring techniques.